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 HAT2204C
Silicon N Channel MOS FET Power Switching
REJ03G0448-0500 Rev.5.00 May 10, 2007
Features
* Low on-resistance RDS(on) = 26m typ.(at VGS = 4.5 V) * Low drive current * High density mounting * 1.8 V gate drive device
Outline
RENESAS Package code: PWSF0006JA-A (Package name: CMFPAK - 6) Index band 4 5 6 2 3
2345 DDD D 6 G 1. Source 2. Drain 3. Drain 4. Drain 5. Drain 6. Gate S 1
1
Absolute Maximum Ratings
(Ta = 25C)
Item Drain to Source voltage Gate to Source voltage Drain current Drain peak current Body - Drain diode reverse Drain current Channel dissipation Channel temperature Storage temperature Symbol VDSS VGSS ID ID (pulse) IDR Pch Note2 Tch Tstg
Note1
Ratings 12 8 3.5 14 3.5 900 150 -55 to +150
Unit V V A A A mW C C
Notes: 1. PW 10 s, duty cycle 1% 2. When using the glass epoxy board (FR4 40 x 40 x 1.6mm)
REJ03G0448-0500 Rev.5.00 May 10, 2007 Page 1 of 7
HAT2204C
Electrical Characteristics
(Ta = 25C)
Item Drain to Source breakdown voltage Gate to Source breakdown voltage Gate to Source leakage current Drain to Source leakage current Gate to Source cutoff voltage Drain to Source on state resistance Symbol V(BR)DSS V(BR)GSS IGSS IDSS VGS(off) RDS(on) RDS(on) RDS(on) Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn - on delay time Rise time Turn - off delay time Fall time Total Gate charge Gate to Source charge Gate to Drain charge Body - Drain diode forward voltage Notes: 3. Pulse test |yfs| Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd VDF Min 12 8 -- -- 0.3 -- -- -- 8.5 -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- 26 34 45 13 770 115 50 10 9.5 36 5 9 1.5 2 0.8 Max -- 10 1 1.2 34 44 69 -- -- -- -- -- -- -- -- -- -- -- 1.1 Unit V A A V m m m S pF pF pF ns ns ns ns nC nC nC V Test conditions ID = 10 mA, VGS = 0 IG = 10 A, VDS = 0 VGS = 6.4 V, VDS = 0 VDS = 12 V, VGS = 0 VDS = 10 V, ID = 1 mA ID = 1.8 A, VGS = 4.5 VNote3 ID = 1.8 A, VGS = 2.5 VNote3 ID = 1.8 A, VGS = 1.8 VNote3 ID = 1.8 A, VDS = 10 V Note3 VDS = 10 V VGS = 0 f = 1 MHz ID = 1.8 A, VGS = 4.5 V VDS = 10 V, RL = 5.6 , Rg = 4.7 VDD = 10 V VGS = 4.5 V ID = 3.5 A IF = 3.5 A, VGS = 0 Note3
REJ03G0448-0500 Rev.5.00 May 10, 2007 Page 2 of 7
HAT2204C
Main Characteristics
Power vs.Temperature Dreating 1.6 100
Test condition When using the glass epoxy board.(FR4 40 x 40 x 1.6 mm)
Maximum Safe Operation Area
Ta = 25C,1 shot pulse
Pch (W)
30
100 s
When using the FR4 board.
ID (A)
10 s
PW
C D
1.2
10
1
= 10
Power Dissipation
Drain Current
3 1 0.3 0.1 0.03
m s
s
0.8
m
0.4
Operation in this area is limited by
pe O t ra n io
RDS(on)
0
50
100
150 Ta (C)
200
0.01 0.03 0.1 0.3
1
3
10 30 100 VDS (V)
Ambient Temperature
Drain to Source Voltage
20
Typical Output Characteristics Pulse Test 4.5 V 2.5 V
1.8 V
Typical Transfer Characteristics 20 25C
ID (A)
ID (A)
16
16 -25C 12 Tc = 75 C
12 1.6 V 8
1.4 V
Drain Vurrent
Drain Current
8
4
VGS = 1.2 V
4 VDS = 10 V Pulse Test 0 1 2 3 Gate to Source Voltage 4 5 VGS (V)
0
2 4 6 Drain to Source Voltage
8 10 VDS (V)
Drain to Source Saturation Voltage vs. Gate to Source Voltage 160
1000
Drain to Source On State Resistance vs. Drain Current Pulse Test
Drain to Source Saturation Voltage VDS(on) (mV)
Pulse Test
120 ID = 3.5 A 80 1.8 A 40 1A 10 0.1 100 VGS = 1.8 V 2.5 V 4.5 V
0
2
4
6
8 VGS (V)
10
1 Drain Current
10 ID (A)
100
Gate to Source Voltage
REJ03G0448-0500 Rev.5.00 May 10, 2007 Page 3 of 7
HAT2204C
Static Drain to Source On State Resistance vs. Temperature 100 Forward Transfer Admittance vs. Drain Current Tc = -25C 25C 10 75C 3 1 0.3 0.1 0.1
VDS = 10 V Pulse Test
Forward Transfer Admittance |yfs| (S)
100 30
80 ID = 3.5 A 60 VGS = 1.8 V 1A 40 2.5 V 1, 1.8 A 20 0 -25 4.5 V 1, 1.8, 3.5 A Pulse Test 0 25 50 75 100 125 150 Tc (C) Case Temperature 3.5 A 1.8 A
0.3
1
3
10
30
100
Drain Current
ID (A)
Dynamic Input Characteristics 40
VDS (V)
Typical Capacitance vs. Drain to Source Voltage 8
VGS (V)
10000 3000
ID = 3.5 A 30 VDD = 12 V 10 V 5V 20 VDD = 12 V 10 V 5V VDD 0 4 8 12 16 Gate Charge Qg (nC) Reverse Drain Current vs. Source to Drain Voltage 0 20 6
VGS = 0 f = 1 MHz Ciss
VGS
Drain to Source Voltage
Gate to Source Voltage
Capacitance C (pF)
1000 300 100 30 10 3 1
Coss
4
Crss
10
2
0
2
4
6
8
10 VDS (V)
12
Drain to Source Voltage
20
IDR (A)
1000
Switching Characteristics
Switching Time t (ns)
16 12
5V tr 100 td(off)
Reverse Drain Current
VGS = 0 , -5 V
8
10
td(on) tf
4 Pulse Test 0 0.4 0.8 1.2 1.6 2.0 Source to Drain Voltage VSD (V)
1 0.1
0.3
1
3
10
30
100
Drain Current
ID (A)
REJ03G0448-0500 Rev.5.00 May 10, 2007 Page 4 of 7
HAT2204C
Switching Time Test Circuit Vin Monitor D.U.T. RL 4.7 Vin 4.5 V VDS = 10 V Vin Vout 10% 10% 90% td(on) tr 90% td(off) tf 10% Vout Monitor Switching Time Waveform
90%
REJ03G0448-0500 Rev.5.00 May 10, 2007 Page 5 of 7
HAT2204C
Package Dimensions
Package Name CMFPAK-6 JEITA Package Code RENESAS Code PWSF0006JA-A Previous Code CMFPAK-6 / CMFPAK-6V MASS[Typ.] 0.0065g
D e A c LP
E
HE
A xM
A S A b
L
e A2 A
Reference Symbol
Dimension in Millimeters
yS
A1 S e1 b l1
c
b2 Pattern of terminal position areas
A-A Section
A A1 A2 b c D E e HE L LP x y b2 e1 l1
Min 0.7 0 0.7 0.15 0.1 1.9 1.6 2.05 0.1 0.15
Nom
0.2 0.15 2.0 1.7 0.65 2.1 0.2
Max 0.8 0.01 0.79 0.3 0.25 2.1 1.8 2.15 0.3 0.45 0.05 0.05 0.35 0.5
1.65
Ordering Information
Part Name HAT2204C-EL-E Note: Quantity 3000 pcs Taping Shipping Container
For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
REJ03G0448-0500 Rev.5.00 May 10, 2007 Page 6 of 7
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.0


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